[vc_row][vc_column][vc_column_text dp_text_size=”size-4″]Micron has just released its UFS 4.0 mobile storage solution, and it has already distributed certification samples to select smartphone makers and chipset vendors throughout the world. This outperforms Samsung’s current UFS 4.0 technology.
Simply put, Android phones will soon have quicker storage, beginning with flagship devices.
Are you ready for the next big thing in #mobile storage? Introducing Micron UFS 4.0 storage, purpose-built for flagship smartphones. Built on advanced 232-layer 3D NAND, it delivers best-in-class performance and power in capacities up to 1TB. https://t.co/PWqS252Ccc pic.twitter.com/lnAXWFlwOW
— Micron Technology (@MicronTech) June 21, 2023
This new technology will allow storage capacities ranging from 256 GB to 1 TB to be manufactured. While mass manufacturing is expected to begin in the second half of this year, it may be some time before the first smartphones with Micron UFS 4.0 storage become available.
Also Read: Power outages galore as shortfall exceeds 6,000MW
This suggests that UFS 4.0 will most likely be available in top Android phones by the beginning of 2024, possibly with Samsung’s Galaxy S24 series.
Specifications
Micron’s storage system is built with 232-layer TLC flash technology, which enables for three bits per cell storage. The company claims that their six-plane NAND architecture improves random read throughput, outperforming previous-generation storage.
Micron’s UFS 4.0 storage offers excellent sequential read rates of up to 4,300 MBps and sequential write speeds of up to 4,000 MBps. These rates significantly beat Samsung’s UFS 4.0, especially in write performance.
Furthermore, the recently released UFS 4.0 chips have a 25% increase in power efficiency, enabling more energy-efficient operation. They also promise a 10% reduction in write latency, resulting in speedier data storage and retrieval.
[/vc_column_text][/vc_column][/vc_row]
